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PCB assembly Mass production based in Shenzhen China with Good lead time and Competitive Price
PCB assembly Mass production based in Shenzhen China with Good lead time and Competitive Price
Hitech Circuits Co., Limited is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years' experience in the electronics manufacturing industry.
We focus on PCB Design, PCB Layout, Circuit board fabrication, Turnkey PCB assembly, and electronic parts sourcing services.
With mature supply chain, talented design team, advanced manufacturing techniques and quality control systems, Hitechpcba is able to provide one-stop electronics manufacturing services and solution for our customers to help them stand out in the marketplace.
Our team of Engineers is constantly striving to improve our processes by working with our customers and industry colleagues. Using innovative resources, tools, and training, our engineers design each assembly process to function like a well-oiled machine.
The circuit board before the assembly of electric components is called Printed Circuit Board. After the soldering of all the elements on the board, it is known as Printed circuit Board Assembled, we called PCB assembly. The complete process of component’s assembly is called Printed Circuit Assembly or Printed Circuit Board assembly or PCB board assembly. In this process, different automatic and manual assembly tools are used. We are assembler that offer PCB assembly.
The PCBA SMT process mainly includes solder paste printing, component mounting, reflow soldering, and subsequent testing and insertion. Depending on the board design, it can be divided into various modes such as single-sided SMT, single-sided DIP, or mixed assembly. The entire process aims to accurately fix electronic components onto the circuit board and ensure reliable electrical connections. The following are the specific process steps and key control points.
Five core steps of SMT surface mount
Solder paste printing: This is the first process of SMT, where the solder paste is accurately printed onto the PCB pads through a steel mesh. The thickness of the solder paste is usually controlled between 0.1~0.2mm. After printing, SPI testing should be carried out immediately to check whether there is insufficient solder, sharp or offset solder paste, and to intercept defects from the source.
Component mounting: Using a high-speed surface mount machine, the components are sucked up through a vacuum nozzle, and the visual system is used to identify the Mark points. Resistors, capacitors, ICs, and other components are mounted to the designated positions with an accuracy of ± 0.02mm. For ultrafine components such as 01005, the mounting accuracy requirement even needs to reach ± 25 μ m.
Reflow soldering: The assembled PCB enters the reflow soldering furnace and undergoes four temperature zones of preheating, insulation, reflow, and cooling to melt the solder paste and form permanent solder joints. The peak temperature of lead-free process is usually between 235~245 ℃, and the temperature curve needs to be strictly controlled to prevent component damage or cold soldering.
AOI optical inspection: After welding is completed, use automatic optical inspection equipment to scan the solder joints and check for defects such as virtual soldering, bridging, offset, or missing parts.
Repair and re inspection: Repair the defective products detected by AOI. If a hot air gun is used for re welding, re inspection is required after repair until they are qualified.
DIP plugins and soldering supplements
Plug in operation: For irregular components such as connectors and high-power capacitors that cannot be mounted, they need to be manually or automatically inserted into PCB through holes using a plug-in machine.
Wave soldering: The PCB after insertion is soldered using a wave soldering machine, where the molten solder wave contacts the pins to complete the soldering process. After soldering, the excess pins need to be cut off by trimming the pins.
Cleaning and welding repair: After welding, clean the residual flux to avoid corrosion risks, and manually repair the missing solder joints. Some high-end products adopt a non-cleaning process.
Key parameters and quality inspection
Environmental control: It is recommended to control the temperature in the production workshop at 22 ± 3 ℃ and the relative humidity at 40-60% to prevent solder paste from absorbing moisture or component oxidation.
Test verification: The finished product needs to undergo ICT online testing (checking for continuity), FCT functional testing (simulating actual working conditions), and X-ray inspection (checking the internal solder joints of BGA).
Three proof treatment: Depending on the usage environment, it may be necessary to spray three proof paint (moisture-proof, anti-corrosion) with a thickness generally ranging from 0.1 to 0.3mm. After curing, the shell should be assembled and shipped.
We can review your project data files and have a customized quote back to you in as little as 24 hours. We can send your PCBs in as little as 10 days from the placement of an order using our advanced PCB assembly process.
Our team works fast without compromising the quality of our output. We have professional engineers and high-quality automated equipment that you are satisfied with every board we complete.
Apart from providing quality custom PCBs, we provide exceptional customer service. Our sales representatives will work closely with you to make sure that your designs are implemented the way you intended. Also, we can provide good after-sales service.
For full turn-key circuit board assembly, we take care of the entire process, including Printed Circuit Boards fabrication, components sourcing, order tracking, continuous monitoring of quality and final PCB board assembly. Whereas for partial turn-key, the customer can provide the PCBs and certain components, and the remaining parts will be handled by us.
https://www.hitechpcba.com/industrial...
Please feel free to contact sales1@hitechpcb.com if you have any PCB needs.
