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Good Quality Aluminum LED PCB with Fast Lead Time Made in China
Good Quality Aluminum LED PCB with Fast Lead Time Made in China
Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and lighting products, etc.
Aluminum substrate is a metal based copper-clad laminate with good heat dissipation function. Generally, a single panel is composed of three layers: circuit layer (copper foil), insulation layer, and metal substrate. Commonly seen in LED lighting products. There are two sides, the white side is for soldering LED pins, and the other side presents the natural color of aluminum, usually coated with thermal conductive paste and in contact with the thermal conductive part. There are also ceramic substrates and so on.
Hitech Circuits Co., Limited is a professional aluminum pcb board, LED PCB manufacturer in China. Through 10 years of aluminum pcb board designing and manufacturing experience, Hitech are able to provide high quality and cost effective single layer, double layer and multi layer aluminum pcb boards to global customers.
What is aluminium PCB board ?
Aluminium PCB board, also named Aluminium based PCB, metal clad (MCPCB) PCB, insulated metal substrate(IMS or IMPCB) PCB, thermally conductive PCBs, etc. Aluminum printed circuit board ( PCB ) is a unique metal-based copper clad laminate with good thermal conductivity, electrical insulation performance and mechanical processing performance. It is composed of copper foil, thermally conductive insulating layer and metal substrate. It is generally including single layer, double layer and multi layer aluminum pcb board.
The structure of aluminum printed circuit boards
Generally speaking, the PCB aluminum substrate is composed of a circuit layer, a thermally conductive insulating layer and a metal base layer; it can be divided into three layers:
Circuit layer: equivalent to the copper clad laminate of an ordinary PCB, the thickness of the circuit copper foil is 1 to 10 oz. The circuit layer (that is, copper foil) is usually etched to form a printed circuit to connect the various components of the assembly. Generally, the circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, with a thickness of 35μm~ 280μm;
Insulation layer: The insulation layer is a layer of low thermal resistance thermally conductive insulating material. The thickness is 0.003 to 0.006 inches. It is generally composed of a special polymer filled with special ceramics. It has low thermal resistance, excellent viscoelasticity, thermal aging resistance, and can withstand mechanical and thermal stress. It is the core technology of aluminum-based copper clad laminates. Our aluminum printed circuit boards have obtained UL certification.
Aluminum substrate (metal based heat dissipation plate (including aluminum substrate, copper substrate, and iron-based plate) is a low-alloy Al Mg Si high plasticity alloy plate (structure shown in the figure below), which has good thermal conductivity, electrical insulation performance, and mechanical processing performance. Compared with traditional FR-4, aluminum substrate can carry higher current with the same thickness and line width. The withstand voltage of aluminum substrate can reach 4500V, and the thermal conductivity coefficient is greater than 2.0. Aluminum substrate is mainly used in the industry.
Adopting surface mount technology (SMT);
Efficient treatment of thermal diffusion in circuit design schemes;
Reduce product operating temperature, improve product power density and reliability, and extend product service life;
Reduce product size, lower hardware and assembly costs;
Replace fragile ceramic substrates for better mechanical durability. Structure
Aluminum based copper-clad laminate is a metal circuit board material composed of copper foil, thermal insulation layer, and metal substrate. Its structure is divided into three layers:
Cireuitl. Layer circuit layer: equivalent to the copper-clad laminate of a regular PCB, with a copper foil thickness of Loz to 10oz.
DielcctricLayer insulation layer: The insulation layer is a layer of low thermal resistance and thermal conductivity insulation material. The core technology of aluminum based copper-clad laminates lies in the thickness range of 0.003 "to 0.006" inches, which has obtained UL certification.
BaseLayer: It is a metal substrate, usually made of aluminum or optional copper. Aluminum based copper-clad laminates and traditional epoxy glass cloth laminates.
PCB materials have unparalleled advantages compared to other materials. Suitable for surface mount SMT of power components. No need for a radiator, greatly reduced size, excellent heat dissipation effect, good insulation and mechanical properties.
https://www.hitechpcba.com/aluminium-...
