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High quality Ceramic PCB made in China with cheaper price by Hitech Circuits
High quality Ceramic PCB made in China with cheaper price by Hitech Circuits Co., Limited
What is Ceramic PCB?
Ceramic PCB board is also called ceramic substrate, ceramic circuit board, ceramic copper coated plate, ceramic substrate refers to the copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate or other ceramic substrate surface (single or double) on the special process board.
The ceramic pcb can be described as an organic binder and ceramic powder that conducts heat. The thermal conductivity at which this PCB is prepared is between 9 to 20W/m.
To explain further, ceramic PCBs are printed circuit boards, with ceramic as its base material. This base material is highly thermally conductive like aluminum nitride, alumina, and beryllium oxide. These are very effective in the transfer of heat from hot spots and then dissipating this heat over the entire surface.
Asides from this, the fabrication of ceramic PCB is done with the LAM technology. This technology is a laser quick activation metallization type. Therefore, ceramic PCBs are highly versatile and can easily substitute the whole traditional PCBs. This PCB will achieve this with even more enhanced performance and involving less complicated construction.
1. The difference between ceramic substrate and pcb board
Ceramic substrate is that we say ceramic circuit board, ceramic pcb and printed circuit board have the same circuit interconnection, through hole conduction characteristics. So what are the differences between ceramic substrate and pcb board?
(1)The thermal conductivity of PCB board and ceramic substrate is different
Ceramic substrate is made of ceramic substrate, that is, the medium is ceramic material, including alumina ceramic base, aluminum nitride ceramic base, silicon nitride ceramic base, ceramic heat dissipation performance is very good, the thermal conductivity of ceramic substrate from 25w to 230w, different ceramic medium thermal conductivity is different. The thermal conductivity of alumina ceramic substrate is 25w~30w, the thermal conductivity of aluminum nitride ceramic substrate is above 170w, and the thermal conductivity of silicon nitride ceramic substrate is 80w~90w. Then pcb board is usually the use of medium is fr4 or metal substrate, thermal conductivity is less than 3w, and the gap is too large compared with ceramic substrate, especially the need for high heat dissipation performance of the product field, ceramic substrate has become a very popular medium material.
2. Ceramic substrate and pcb board insulation is different
Ceramic substrate is generally line layer - ceramic base - line layer structure, ceramic substrate insulation is very good, is also determined by the ceramic material itself, no need to add insulation layer. pcb board needs to add an insulating layer to play a mobile insulation role, but the insulation effect is far less than ceramic substrate.
(3)The heat dissipation structure of ceramic substrate is different from that of pcb board
The heat dissipation structure of the ceramic substrate is the structure of the circuit layer - ceramic base - circuit board layer. Because there is no insulating layer in the middle, the heat of the device is transferred directly from the ceramic base to the circuit layer and the heat dissipation is out, the heat dissipation is fast and the effect is good. pcb board is the need for heat from the medium layer - insulation layer - line layer, separated by an insulation layer at the same time, the dielectric layer itself of the thermal conductivity is poor, then add heat conduction adhesive, heat conduction effect is still not improved, often can not achieve the purpose of rapid heat dissipation device. In particular, some high-power devices need to use ceramic substrate as a cooling substrate in the product field where the heat dissipation and temperature change is relatively large.
(4)Ceramic substrate and pcb board application is different
Ceramic substrate and pcb board application is different, mainly the performance of the two is different, ceramic substrate is used in high thermal conductivity, high heat dissipation, high insulation, product field, such as high power LED lighting, high power module, high-frequency communication, track power supply; Ordinary pcb board is used in some more extensive, heat dissipation, insulation and other requirements are not strict, used in private commercial commodities.
(5) The price of ceramic substrate is different from that of pcb board
The material and performance of ceramic substrate and pcb board are different, and the final decision is that their prices are different. The board of ceramic substrate is very high and the production cost is high.
Ceramic substrate has outstanding advantages, but the ceramic substrate is fragile and has a high scrap rate, which requires a high level of production technology. However, you can't make a circuit board with the size of more than one meter like ordinary pcb boards. Hitech Circuits has more than 10 years of experience in the ceramic circuit board industry, and many universities and R & D institutions are in cooperation, welcome to inquiry.
2.Ceramic substrate and high-frequency plate difference
The material is different. The ceramic substrate is made of aluminum oxide or aluminum nitride, and the high frequency plate is made of Rogers, Yaron, PTFE, etc., with low dielectric constant and high frequency communication speed.
Performance is different. Ceramic substrate is widely used in refrigeration and systems, high power modules, automotive electronics and other fields. High frequency board is mainly used in high frequency communication field, aviation, high-end consumer electronics and so on. High-frequency communication field involves heat dissipation requirements, usually need to be combined with the ceramic base and high frequency plate, such as high frequency ceramic pcb.
1. Application of ceramic substrate
Ceramic substrates are used in led chips to achieve better thermal conductivity. In addition, ceramic substrate is also used to make ceramic chips in the following electronic devices:
◆High power semiconductor module
◆Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit
◆Intelligent power module; High frequency switching power supply, solid state relay
◆Automotive electronics, aerospace and military electronics components
◆Solar panel module; Telecommunications private exchange, receiving system; Laser and other industrial electronics
Application of ceramic substrate in third generation semiconductor
The mainstream power devices represented by MOSFET, IGBT and transistor occupy a place in their own frequency and power supply segments. Due to the comprehensive excellent performance of IGBT, it has replaced GTR, become the inverter, UPS, frequency converter, motor drive, high-power switching power supply, especially now the hot electric vehicle, high-speed rail and other power electronic devices in the mainstream devices.
Application of alumina ceramic substrate in electronic power field
In the field of power electronics, such as power switching power supply, electric drive, etc., dielectric ceramic substrate is needed to achieve better thermal conductivity, prevent current burn out and short circuit.
Application of alumina ceramic co-fired plate in lithium battery industry
With the recommendation of artificial intelligence and environmental protection, the automobile industry has also launched electric cars, mainly through battery storage. Lithium batteries made of ceramic substrate can achieve better current and heat dissipation functions, promoting the market demand for new energy vehicles.
2. Advantages of ceramic substrate
A. The thermal expansion coefficient of ceramic substrate is close to that of silicon chip, which can save Mo sheet of transition layer, save labor, save material and reduce cost;
B. Reduce the welding layer, reduce the thermal resistance, reduce the cavity;
C. Under the same load flow, the wire width of copper foil 0.3mm thick is only 10% of that of ordinary printed circuit board;
D. Excellent thermal conductivity, so that the chip packaging is very compact, so that the power density is greatly increased, improve the reliability of the system and device;
E. Ultra-thin (0.25mm) ceramic substrate can replace BeO, without environmental toxicity problems;
F. Large load capacity, 100A current continuously through 1mm wide 0.3mm thick copper body, temperature rise about 17℃; With 100A current continuously passing through a 2mm wide 0.3mm thick copper body, the temperature rise is only about 5℃.
G. Low thermal resistance, 10×10mm ceramic substrate 'thermal resistance of 0.63mm thickness of ceramic substrate is 0.31K/W, 0.38mm thickness of ceramic substrate is 0.19K/W, 0.25mm thickness of ceramic substrate is 0.14K/W.
H. High insulation and high pressure resistance to ensure personal safety and equipment protection.
I. New packaging and assembly methods can be realized, so that the product is highly integrated and the size is reduced.
If you want to learn more information and want a quote,please feel free to contact sales1@hitechpcb.com and visit us at https://www.hitechpcba.com/ceramic-pcb
Status:
Abierta abr. 29, 2026 - 02:14
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