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Professional Manufacturing Service for Ceramic PCB in China Shenzhen with Good Quality by Hitech Circuits Co., Lim
Ceramic circuit board, also known as thermally conductive organic ceramic circuit board, is an electronic substrate prepared using thermally conductive ceramic powder and organic binder under low temperature (<250 ℃) conditions, with a thermal conductivity of 9-20W/m · K. It is mainly applied in fields such as high-power LED lighting, aerospace, high-frequency integrated circuits, and power electronic modules.
This substrate is made of ceramic materials such as alumina and aluminum nitride, and has high thermal conductivity, low thermal expansion coefficient, high temperature resistance, and chemical stability, which are suitable for the thermal management requirements of chip packaging. Compared to traditional FR-4 substrates, its metal film layer has stronger adhesion, supports high-density assembly, and can be used for a long time in reducing environments. The preparation processes mainly include HTCC, LTCC, DBC, DPC, and Active Metal Brazing (AMB). The DBC process achieves bonding between copper foil and ceramics through high-temperature eutectic reaction, which has high current carrying capacity; The DPC process utilizes vacuum coating and photolithography technology to achieve micrometer level circuit accuracy and belongs to low-temperature processes; HTCC requires high temperature sintering above 1300 ℃; LTCC has relatively limited accuracy and thermal conductivity; The AMB process achieves high-strength bonding between ceramics and copper through active metal brazing materials, demonstrating outstanding reliability and heat dissipation performance, especially suitable for high-power scenarios.
The product forms cover single-layer, multi-layer, and hybrid structures, meeting the needs of industrial scenarios such as semiconductor packaging and automotive power modules. With the rapid development of industries such as new energy vehicles and photovoltaic energy storage, the demand for ceramic circuit boards continues to grow, and the industry has broad prospects.
We Hitech Circuits are a professional ceramic pcb manufacturer, supplier from China, we mainly supply high quality Alumina (Al2O3) Ceramic PCB, Aluminum Nitride (AIN) Ceramic PCB board and IGBT Ceramic PCB. Our ceramic printed circuit boards feature of high pressure, high insulation, high temperature, and high reliable and minor volume electronic products, Hitech is your best choice for ceramic PCB boards and needs.
What is ceramic pcb board?
Ceramic pcb boards are actually made of electronic ceramics as the basic material and can be made in various shapes. Among them, the characteristics of high temperature resistance and high electrical insulation of ceramic circuit boards are the most prominent. The advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to components are also very significant.
Different types of ceramic PCB
Ceramic PCB is widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules due to its excellent thermal conductivity and air tightness. But not everyone is clear about the classification. Many manufacturers think ceramic PCBs are expensive and fragile as soon as they hear about ceramic PCBs. Yes, this is indeed a shortcoming of ceramic PCBs, but not all ceramic PCBs are like this. Today we will tell you about the different types of ceramic PCBs.
The performance of ceramic circuit boards (ceramic substrates) largely depends on their substrate materials. Currently, commonly used high thermal conductivity ceramic materials include aluminum oxide (Al ₂ O3), aluminum nitride (AlN), silicon nitride (Si ∝ N ₄), silicon carbide (SiC), and beryllium oxide (BeO). With the increasing environmental requirements, toxic beryllium oxide has gradually withdrawn from mainstream applications; However, the application of silicon carbide in microelectronic circuits is limited due to its poor insulation properties. Al ₂ O ∝, AlN, and Si ∝ N ₄ ceramic powders have been widely promoted and applied due to their non-toxic properties, good high-temperature stability, excellent thermal conductivity, and thermal expansion coefficients that match semiconductor materials such as Si, SiC, and GaAs.
Aluminum oxide (Al ₂ O3) ceramic substrate is currently the most widely used ceramic substrate material due to its low cost, good insulation, and high mechanical strength. However, its thermal conductivity is relatively low, about 20-30 W/(m · K) .
Aluminum nitride (AlN) ceramics have excellent thermal conductivity, with a theoretical thermal conductivity of up to 320 W/(m · K). They also have the advantages of matching thermal expansion coefficient with silicon (Si), non-toxic and environmentally friendly, making them the mainstream material for high-end applications.
Silicon nitride (Si3N4) ceramics not only have high thermal conductivity, but also excellent bending strength and fracture toughness. Their thermal expansion coefficient is close to that of silicon carbide (SiC), making them a highly promising high-strength substrate material.
Beryllium oxide (BeO) ceramics have excellent thermal conductivity (about 250 W/(m · K)), but their application is strictly limited due to the toxicity of the material itself.
The above-mentioned ceramic materials generally have common advantages such as high thermal conductivity, high electrical insulation, low thermal expansion coefficient, good chemical stability, and mechanical strength.
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