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Notes on BGA Design in SMT Processing – Hitech Circuits, PCBA manufacturer
BGA layout design requirements
(1) Layout as close as possible to the transfer edge of the PCB, as deformation is relatively small during soldering.
(2) Try to avoid layout at the corners of L-shaped boards and near crimping connectors as much as possible.
(3) Try to avoid front and back mirror layouts as much as possible. If this layout is necessary, the PCB thickness should be ≥ 2.0mm. This is mainly considered for long-term reliability, based on the research conclusions of multiple well-known enterprises. The reliability of mirror layout BGA is reduced by more than 50%.
(4) PBGA should avoid layout on the first assembly surface (first welding surface, bottom surface) as much as possible.
(5) BGA should avoid layout near the separation edge of the layout as much as possible.
Email to Cynthia: sales11@hitechpcb.com if you are interested in PCB or PCBA service.
