Quomon.esRespuesta
Esta pregunta todavía no ha sido respondida.
Rigid Flex PCB with Good Quality Produced in Shenzhen China
什么是刚挠结合板？
刚挠结合板是由刚性电路板和柔性电路板永久连接而成。Hitech Circuits公司拥有丰富的经验。
刚挠结合电路板的合理应用为空间受限的复杂环境提供了最佳解决方案。该技术能够确保设备组件之间的安全连接，保证极性和接触稳定性，并减少插头和连接器组件的数量。
刚挠结合板是一种将柔性电路板和刚性电路板技术相结合的电路板。大多数刚挠结合板由多层柔性电路板构成，这些柔性电路板根据应用设计，从外部和/或内部连接到一层或多层
刚性电路板上。柔性基板设计为保持恒定的挠度，通常在刚挠结合板的制造或组装过程中形成挠度曲线。
请将PCB文件发送至sales1@hitechpcb.com以获取报价！
高科技刚挠性PCB制造工艺
FPC柔性板生产完成后，Hitech刚挠结合PCB板的生产可以通过以下流程完成。
1. 拳击
Drill holes on FR4 and PP film, and the design on the alignment hole is not the same as the general through hole. After the punching is completed, browning is required.
2. Riveting
Laminate copper clad laminates, PP adhesives, and FPC circuit boards and place them neatly. The original old process is to laminate and pressing step by step, but it is a waste of time. After many attempts, we found that the stacking process can be completed once.
3. Laminate
This is a relatively complete step in the production of rigid-flex pcb board. Most of the materials are integrated for the first time. First, the bottom layer is copper clad laminate and PP film, above are the FPC flexible board produced in the previous process, and a PP film is placed on the FPC flexible board, then place the last layer of copper clad laminate. All materials to be laminated are placed in order and pressed together.
4. Trimming
That is to remove the part of the circuit board where there is no circuit at the edge of the circuit board currently and in the future. Afterwards, it is necessary to measure whether the material has excessive expansion and contraction. Because the PI used in the production of flexible boards is also expansion and contraction, this has a very large impact on the production of circuit boards.
5. Drilling
This step is the first step to turn on the entire circuit board, and the production parameters should be produced according to the design parameters.
6. Desmear
First, remove the scum generated by the drilling of the circuit board, and then use plasma cleaning to clean the through holes and the board surface.
7. Immersion copper
This step is the process of electroplating through holes, also known as hole metallization. Realize through-hole power conduction.
8. Plate plating
Partially electroplating copper on the upper surface of the electroplating hole makes the copper thickness above the through hole exceed a certain height of the copper clad board surface.
9. Outer dry film positive film production
The same as the production process of the anti-corrosion dry film of the FPC board, the circuit to be etched on the copper clad board is made. After the development is completed, check the circuit.
10. Graphic plating
After the initial copper sinking, pattern electroplating is performed, and the current time and copper plating wire are used according to the design requirements to reach a certain electroplating area.
11. Alkaline etching
12. Print solder mask
This step has the same effect as the FPC board protective film. We see that the PCB rigid board is generally green. This step is generally called green oil printing. After the printing is completed, the inspection is carried out.
13. Open the cover
Cover opening, which is the area where the FPC board is located, but the area not needed by the rigid board is laser cut to expose the FPC board.
14. Curing
It is also a baking process.
15. Surface treatment
通常情况下，此时刚挠结合板已经制造完成，只需要对电路板表面进行金属化处理，以防止磨损和氧化。一般来说，该工艺是将电路板浸泡在化学溶液中，溶液中的金属元素会密集
地分布在电路板的电路表面。
16. 字符打印
待组装零件的位置和一些基本产品信息以文字形式印在刚柔结合板上。
17. 测试
这是检验电路板是否合格的过程。测试项目根据客户要求进行电气性能测试。测试项目通常包括阻抗测试、开路测试和短路测试等。
18. 最终检查
19. 包装和运输
电路板的包装方式有很多种。通常，Hitech会先用包装袋将电路板分隔开，然后再用真空包装机对刚挠结合板进行真空包装。
刚挠结合式PCB板的优势
1）它可以有效节省电路板空间，并省去连接器的使用。
由于柔性电路板 (FPCB) 和刚性电路板 (RPCB) 被整合在一起，原本用于连接器的空间得以节省。对于一些高密度要求的电路板来说，减少连接器的数量更为有利。这样一来，也节省了使用连接器的元件成本。此外，由于无需使
用连接器，两块电路板之间的空间可以更加紧凑。
2）信号传输距离缩短，速度提高，可以有效提高可靠性。
传统的连接器信号传输路径为“电路板→连接器→柔性PCB板→连接器→电路板”，而刚挠结合板的信号传输路径则简化为“刚性电路板→柔性PCB板→刚性电路板”，缩短了
不同介质间的信号传输距离，也减少了不同介质间信号传输衰减的问题。通常情况下，PCB板上的电路采用铜箔，连接器的触点采用镀金工艺，焊盘则采用全镀锡工艺。此外，电
路板上还需要焊接焊膏，不同介质间的信号传输不可避免地会受到衰减。如果改用刚挠结合板，这些介质的数量就会减少，信号传输能力可以得到相对提升。对于一些对信号精度要
求较高的产品，这有助于提高其可靠性。
3）简化产品组装并节省组装时间
使用刚挠结合板可以减少SMT元件的人工工时，因为连接器的数量减少了。它还可以减少整机组装的人工工时，因为它省去了将FPC板插入连接器的组装步骤。此外，由于所需
零件数量减少，管理成本也随之降低，从而降低了零件管理和库存成本。
如果您想了解更多信息或获取报价，请 访问 https://www.hitechpcba.com/rigid-flex...
Status:
Abierta oct. 29, 2025 - 23:15
¿Tiene la misma pregunta? Siga esta pregunta
0
Comparta su propia experiencia y conocimientos
Buscamos asegurarnos de que cada pregunta sea respondida por las mejores personas con conocimientos y experiencia relevantes; las mejores respuestas incluyen múltiples perspectivas. ¿Tiene conocimientos o experiencia relevantes para contribuir con su respuesta a alguna de estas preguntas frecuentes?
Añadir Nuevo Comentario